void (Total 2726 Patents Found)

Void (2726 Patents Found)
A primary circuit board has a front surface, a back surface, and a non-conductive void. The void has first planar dimensions through a first portion of a thickness of the primary circuit board extending from the front surface to a position between the front and back surfaces, and second planar dimensions through a seco...
Cu or a Cu alloy is deposited to partially fill openings in a dielectric layer and then annealed. Incomplete filling leaves room in the openings to accommodate a volume change associated with grain growth and, hence, prevents the generation of voids. The openings are then completely filled, annealed a second time and t...
Methods of constructing a void-free, cellulose-free electrical winding insulated with a solid resinous insulation. The method includes forming a plurality of conductor turns on a substrate, with each conductor turn being immersed in liquid resinous insulation as it is formed, to provide a void-free intermediate structu...
One aspect of the present invention relates to a method of forming an innerlayer dielectric, involving the steps of providing a substrate having at least two metal lines thereon; providing a conformal insulation layer over the substrate and metal lines; forming a second insulation layer over the conformal insulation la...
Composition comprising a source of metal ions and at least one suppressing agent obtainable by reacting a) an amine compound comprising at least three active amino functional groups with b) a mixture of ethylene oxide and at least one compound selected from C3 and C4 alkylene oxides....
The invention provides a technique of monitoring the void formation in a damascene interconnection process. According to the invention, a test structure is provided that includes at least two damascene structures that have at least one different cross-sectional geometric parameter. To monitor the void formation, the te...
The present invention relates to a disposable absorbent article, such as a diaper, training pants, adult incontinence article, having a specific topsheet with an opening to receive bowel movement waste (BM) and which is such that it masks the waste present underneath said topsheet. The topsheet is air permeable and it ...
A trimming capacitor with less drop in Q due to laser trimming, wherein a non-reducing ceramic material which can be sintered either within a neutral atmosphere or a reducing atmosphere is used as the material of the ceramic dielectric. A trimming capacitor electrode is provided on the surface of or within a ceramic di...
The present invention discloses a self standing network or scaffold of nanoparticles with controllably variable mesh size between 500 nm and 1 mm having particle volume fraction between 0.5 to 50%. The network comprises nanoparticles, a surfactant capable of forming ordered structured phases and a cross linking agent, ...
(57)【要約】 【課題】 修正した白欠陥の加工品質を低下する遮光膜 のハロー成分を低減し、ビーム径で決まる最小加工寸法 よりも小さな白欠陥の高品位な修正を可能にする。 【解決手段】 ナフタレン等を原材料とするFIB-CVD膜2 5が、ガ...
Briefly described, embodiments of the present disclosure include trilobal bulked continuous filaments (BCFs) with a generally round central void, spinneret plates with a capillary design for producing the BCFs of the present disclosure, articles and carpets produced from the BCFs of the present disclosure, methods of p...
Methods for forming porous insulative materials for use in forming dielectric structures of semiconductor devices are disclosed. Each insulative material may include a first, substantially nonporous state and a second, porous state. When in the first state, the insulative materials may be processed or support layers or...
A ceramic transverse-electromagnetic-mode filter having a waveguide cavity mode frequency shifting void and method of tuning same is provided. The ceramic filter includes a filter body (200) comprising a block of dielectric material and having top (202), bottom (204) and four side surfaces (206, 208, 210, 212) includin...
The present invention relates to a disposable absorbent article, such as a diaper, training pants, adult incontinence article, having a specific topsheet with an opening to receive bowel movement waste (BM) and which is such that it masks the waste present underneath said topsheet. The topsheet is air permeable and it ...
A collapsible void filler is provided which, when in an expanded state, prevents relative movement between cargo during transit. The void filler is formed as a pair of side panels, a pair of bases secured to the side panels, and at least one beam structure located in the interior defined by the side panels and the two ...
Void boundary structures, semiconductor devices having the void boundary structures, and methods of forming the same are provided. The structures, semiconductor devices and methods present a way for reducing parasitic capacitance between interconnections by forming a void between the interconnections. The interconnecti...
A printer controller system for controlling printing on media (e.g., a strip of labels) supporting a series of RFID transponders and for communicating detection of void RFID transponders to downstream devices. The printer controller system includes a void detection system for detecting void RFID transponders, a printin...
In a first aspect, a first apparatus is provided. The first apparatus includes a void formed around one or more portions of a microelectronic device in a bulk substrate. The void is adapted to reduce a parasitic leakage between the microelectronic device and the bulk substrate. Numerous other aspects are provided....
Thermal interface materials and method of using the same in packaging are provided. In one aspect, a thermal interface material is provided that includes an indium preform that has a first surface and a second surface opposite to the first surface, an interior portion and a peripheral boundary. The indium preform has a...
The present invention describes the use of nanoparticle interfaces to chemically process solid nanomaterials into ones with tailorable core-void-shell architectures. The internal void sizes are proportional to the nanoparticle size, the shell thickness and composition, and can be either symmetric or asymmetric dependin...
A method for forming a layer of monocrystalline diamond cubic material on a mask comprises initially providing a substrate having a monocrystalline surface which is parallel to a {100}-type crystallographic plane. A mask is then formed on the substrate, the mask including at least two apertures and each aperture includ...
Documents for minimizing and detecting fraudulent activity are provided. The document comprises a printable substrate, a first security feature that forms a latent copy-void warning message that visually appears on an electronically printed reproduction of the document original, and a second security feature that forms...
A new method of forming controlled voids within the intermetal dielectric and within the passivation layer of an integrated circuit is achieved. A first layer of patterned metallization is provided over semiconductor device structures in and on a semiconductor substrate. An intermetal dielectric layer is deposited over...
A method of producing nitrogenated metal alloys which involves melting a al alloy under a nitrogen atmosphere and subsequently gas atomizing the molten alloy with nitrogen gas has been found to produce alloys powders having a high nitrogen content and a minimum amount of hollow particles. The resulting alloy powders w...
A bulked continuous filament with a three-sided exterior configuration is characterized in that each side has a smoothly curved contour extending between a first and a second rounded tip with an inwardly extending depressed region being disposed adjacent to each tip. Generally, the filament has an exterior modification...
A method of determining or assessing remaining life in insulation material includes using a computerized analytical model and supporting equipment to assess margin between an electrical insulation sample's given (i.e., known) void parameters (such as size and density) and void parameters corresponding to the thresh...
Die Erfindung betrifft ein Verfahren zum Erzeugen von in Submikrometer-Abmessungen strukturierten Hohlräumen (7) in einer Hohlraumschicht (3) einer Halbleitereinrichtung, wobei auf den Stegen (5) einer von Stegen (5) und Gräben strukturierten Arbeitsschicht ein Prozessmaterial aufgebracht und polymerisiert wird, sich...
A structure for a tread pattern of a pneumatic tire includes a radially extending pedestal, a first set of cylindrical voids extending radially through the pedestal, a second set of cylindrical voids extending radially through the pedestal, and a radially extending void ring circumscribing the pedestal....
Process for the hydrotreating of a hydrocarbon feedstock, wherein the feedstock is passed through a fixed bed catalyst system of a hydrotreating catalyst comprising a physical mixture of high void catalyst particles and low void catalyst particles, which particles are mixed in different amounts in different layers of t...