液状エポキシ樹脂組成物及びフリップチップ型半導体装置

Liquid epoxy resin composition and flip chip type semiconductor device

Abstract

PROBLEM TO BE SOLVED: To provide a liquid epoxy resin composition capable of providing a cured product having extremely suitable workability and extremely good adhesiveness to element surface (particularly a photosensitive polyimide, a nitrided film or an oxidized film), and having high moisture resistance and particularly capable of becoming a sealing material excellent in high-temperature thermal shock and having ≥260°C reflow temperature and to provide a flip chip type semiconductor device sealed with the cured product of the composition. SOLUTION: The liquid epoxy resin composition comprises (A) a liquid epoxy resin, (B) an aromatic amine-based curing agent comprising one or more kinds of aromatic amine compounds represented by formulas (1) to (3) (wherein R 1 to R 4 are each hydrogen or a 1-6C monovalent hydrocarbon group) in an amount of ≥5 mass% based on whole curing agent and (C) an inorganic filler, having 0.1-5 μm average particle diameter, in which the content of the inorganic filler having a particle diameter of ≥1/2 based on gap size of flip chip type semiconductor device is ≤0.1 mass% based on whole inorganic filler. The flip chip type semiconductor device is obtained by sealing with the cured product as an underfill material. COPYRIGHT: (C)2005,JPO&NCIPI
【解決手段】(A)液状エポキシ樹脂 (B)式(1)〜(3)で表される芳香族アミン化合物の1種又は2種以上を硬化剤全体の5質量%以上含有する芳香族アミン系硬化剤 (C)平均粒径0.1〜5μmであり、フリップチップ型半導体装置のギャップサイズに対して1/2以上の粒径のものが無機質充填剤全体の0.1質量%以下である無機質充填剤 を含有する液状エポキシ樹脂組成物、及びこの組成物の硬化物をアンダーフィル材として封止したフリップチップ型半導体装置。 【化1】 (R 1 〜R 4 はH又はC1〜6の一価炭化水素基。) 【効果】本発明の組成物は、シリコンチップ表面との密着性に優れた硬化物を与え、吸湿後のリフローの温度が上昇しても不良が発生せず、高温多湿の条件下でも劣化せず、温度サイクルにおいても剥離、クラックが起こらない半導体装置が提供できる。 【選択図】 な し

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Cited By (6)

    Publication numberPublication dateAssigneeTitle
    JP-2006219575-AAugust 24, 2006Sumitomo Bakelite Co Ltd, 住友ベークライト株式会社液状封止樹脂及びそれを用いた半導体装置
    JP-2007182561-AJuly 19, 2007Hitachi Chem Co Ltd, 日立化成工業株式会社電子部品用液状樹脂組成物、及びこれを用いた電子部品装置
    JP-2011168634-ASeptember 01, 2011Shin-Etsu Chemical Co Ltd, 信越化学工業株式会社エポキシ樹脂組成物及び半導体装置
    JP-2012216838-ANovember 08, 2012Mitsubishi Chemicals Corp, 三菱化学株式会社Three-dimensional integrated circuit laminate
    US-2010244279-A1September 30, 2010Namics CorporationLiquid resin composition for underfill, flip-chip mounted body and method for manufacturing the same
    US-7981977-B2July 19, 2011Hitachi Chemical Co., Ltd.Sealant for electronics of epoxy resin, aromatic amine, accelerator and inorganic filler