電子部品用パッケージ及びこれを用いた圧電発振器

Package for electronic part and piezoelectric oscillator using it

Abstract

PROBLEM TO BE SOLVED: To provide a package for an electronic part at a low cost in response to miniaturization (a high-density packaging) and a piezoelectric oscillator using the package. SOLUTION: The thickness direction of a metallic cover 3 is positioned by abutting the periphery of a recess formed on the underside of the metallic cover 3 and the periphery of the top face of a printed wiring board 1, and the plane direction of the metallic cover 3 is positioned by abuttedly fixing legs 5 formed at places corresponding to the trench sections 2 of the periphery of the recess into the semicircular trench sections 2 formed to each of one opposed side faces of the printed wiring board 1. COPYRIGHT: (C)2005,JPO&NCIPI
【課題】小型化(高密度実装化)に対応し、且つ、低コスト(単純な構造)の電子部品用パッケージ及びこれを用いた圧電発振器を提供する。 【解決手段】金属カバー3の下面に備える凹陥の周縁とプリント配線基板1の上面の周縁とが当接することで金属カバー3の厚み方向の位置決めし、プリント配線基板1の一方の対向する側面夫々に形成する半円状の溝部2に凹陥の周縁の溝部2に相対する位置に形成する脚部5を衝止することで金属カバー3の平面方向の位置決めする。 【選択図】 図1

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